Implementation of flip chips with bear chips and glass chips.
The flip chip structure can reduce the mounting area compared to wire bonding. Flip chip mounting of bare chips is performed on flexible substrates, rigid substrates, and ceramic substrates. In addition to GGI (Gold to Gold Interconnection) and ACF/ACP (Anisotropic Conductive Film/Paste), there are many other methods for flip chip technology, and we will propose the method you require. We suggest implementing glass on the bare chip. We will also propose the processes following the flip chip as per your requirements.
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Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
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