Introduction to the polishing technique! Both double-sided and single-sided polishing are possible. *Processing examples available.
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
Our company specializes in "precision cutting and polishing processing" of a wide range of materials, including ceramics, crystalline materials, glass, metals, and resins. Among these, in our "polishing technology," we utilize two methods: lapping processing and polishing processing (mirror polishing method) to achieve the desired surface roughness. 【Features of Our Polishing Technology】 ■ Capable of processing a wide range of difficult-to-cut materials ■ Can process thousands to tens of thousands of pieces simultaneously ■ We can provide consistent support for SiC single crystals, which are in growing demand in the power semiconductor market, from outer shape processing and cutting to mirror polishing. *For more details, please download the PDF document or feel free to contact us.
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【Contents of the Document with Examples】 ■ What is polishing processing? ■ Comparison with single-sided and double-sided polishing processing ■ Processing examples Processing of small ceramic pieces Processing of SiC single crystal wafers *For more details, please refer to the PDF download.
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*For more details, please refer to the PDF download.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!
![Surface roughness Ra1nm [Precision grinding / Mirror finish] [Wrapping]](https://image.mono.ipros.com/public/product/image/54f/2000404040/IPROS5416618652046583334.png?w=280&h=280)
