How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now!
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Introducing the "treatable plasma processing width" of our atmospheric pressure plasma device, along with "unique features of our equipment"!
On this page, we focus on atmospheric pressure plasma devices that generate pure bulk plasma, rather than devices that use corona treatment or arcs. We hope this will serve as a reference for optimizing the selection of atmospheric pressure plasma devices, taking into account the nature of the workpieces (items to be treated) and the conditions for the next process. Regarding adhesive-free bonding using oxygen radicals, OH radicals for dry cleaning, and hydrophilic treatment of functional groups, we primarily focus on molecular bonding between copper foil and substrates, enabling bonding that eliminates edge effects. We believe this can contribute to printed circuit boards and assembly processes for future 5G and 6G applications, such as FCCL. Additionally, it can be applied to shorten the impregnation process of electrolytes in lithium-ion batteries and to achieve damage-free direct bonding of dissimilar materials during electrode formation. For more details, please refer to the related links below. [Contents] ■ Purpose of use (treatments possible with atmospheric pressure plasma devices) ■ The treatment forms of atmospheric pressure plasma devices can be broadly classified into three types ■ Workpieces and plasma forms ■ Unique features of our devices (downstream type) ■ Internal schematic diagram of dielectric barrier discharge (DBD) *For more details, please feel free to contact us.
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.