Semiconductor back-end processes, electronic component assembly processes! Contributing to high quality, high reliability, and improved productivity!
Dinatron Co., Ltd. handles "The Resin Coater" manufactured by Engineering Lab Co., Ltd. We offer the "CL Series" for module/chip level coating and the "WL Series" for wafer level coating. We support various shapes of application, including dots, lines, and bezels. 【Features】 ■ High throughput ■ Guard ring and dam formation ■ Sealing of chips, electrodes, etc. ■ High viscosity liquids (over 1000 Pa·s) ■ Full wafer/dot/line coating *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 ■ Full/local application on various substrates ■ No overflow/wrapping (no rinsing required) ■ Thick coating, micro coating, fine coating *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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DynaTron develops and sells system products that effectively control hardware using software. We solve various challenges in circuit board manufacturing and component assembly with software technology.