It can uniformly and well coat large substrates up to 430mm square! It can be applied according to the application, such as square, rectangular, or irregular shapes.
The corner substrate can be uniformly coated in various shapes such as square and rectangular. Additionally, with our rotary cup-type spin coater, you can achieve uniform coating without worrying about certain height differences (many successful cases with high viscosity!). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume, from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Automatic wafer size recognition system ■ Proven track record with various chemicals ■ Reduced footprint ■ Many options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※5 to 6 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
