Compatible with 10,000 cP polyimide and resist! ASAP is a manufacturer specialized in high-viscosity resist and chemicals.
We have strengths in the application of high-viscosity resist! For example, we can achieve an in-plane uniformity of ±5% or better even with resists over 400 cP (φ300mm wafer). Our patented ASAP (A.S.A.P.) rotating cup method allows for uniform and high-quality thick film application (Patent No. 3821468). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we can offer low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Automatic wafer size detection function ■ Proven track record with various chemicals ■ Reduced footprint ■ Numerous options with low resist usage ■ Lineup tailored to production volume * For more details, please refer to the PDF document or feel free to contact us. We also have demo equipment available, so if you're interested, please consider a free demo!
Inquire About This Product
basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
