Optimal for dual-sided processes! Dual-sided automatic photoresist coating device - Coater
By using the wafer inversion unit, both sides of the wafer can be automatically coated!
This device allows for automatic processing of both sides of a wafer with just a single setup. Coating is performed on one side at a time, but using a flipping unit, resist is applied to both sides by the time the automatic operation is complete. The processing is carried out using optimized transport procedures for coating, baking, and flipping to ensure that wafer processing is not rate-limiting. It can accommodate both positive and negative resists, ranging from low to high viscosity. This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. Since we handle everything from design to manufacturing and sales in-house, we have achieved a low price. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low cost ■ Automatically recognizes wafer size for processing ■ Proven track record with a variety of chemicals ■ Reduced footprint ■ Numerous options with minimal resist ■ Lineup tailored to production volume *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
We have numerous achievements in LED, LD, MEMS, SAW, and power device-related fields. *For more details, please feel free to contact us.*
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.
