Hollow silica / Filler for 5G substrates (FCCL/Rigid PCB)
Utilizing the functions of hollow silica for next-generation 5G devices · Providing components with low signal loss, low dielectric constant (εr), and low dielectric loss (tanδ) characteristics.
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basic information
Features 01. High sphericity particles 02. Inert and safe materials 03. Ultra-low density 04. Low specific surface area (BET) 05. Low dielectric constant 06. Ultra-low dielectric loss in the millimeter to microwave range 07. Excellent compatibility with polymers such as PI and LCP 08. High strength particles 09. Low hygroscopicity (surface modification possible) Customizable • Diverse particle sizes • Various surface treatments
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Applications/Examples of results
Applications 01. Filler for 5G substrates (FCCL/Rigid PCB) 02. Filler for adhesives seeking low dielectric constant and low dielectric loss in the millimeter to microwave range
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Since 1994, Sukgyung AT has been developing and manufacturing inorganic ultrafine materials in powder form and dispersed in water or various solvents according to customer applications. Our company provides dispersion technology for various solvents and surface modification of substrates tailored to customer needs. Sukgyung AT's headquarters, manufacturing plant, research and development center, and quality control and assurance department are located in Ansan, South Korea. To expand smooth and efficient production capacity through sales growth, we established and began operating a second factory in Yeonggwang-gun, Jeollanam-do in 2019. In 2002, we established our overseas division (Sukgyung AT Inc.) in Des Plaines, Illinois, near Chicago, USA. Additionally, in October 2014, we established a wholly-owned subsidiary, SG Japan, in Tokyo, providing one-stop support for the overall operations and services of our headquarters, Sukgyung AT, to our Japanese clients. On December 23, 2020, we were listed on the KOSDAQ (357550) in South Korea, recognizing our social responsibilities as a publicly traded company and aiming for further growth and advancement.