A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.
We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■For printed circuit board manufacturing *For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in the sale and import/export of printed circuit board manufacturing equipment and materials, as well as the sale of water treatment-related components. We fully support our customers' production through the supply of domestic and international printed circuit board manufacturing equipment, as well as assembly-related equipment and associated consumables. Please feel free to contact us if you have any inquiries.