Transparent resin / for low dielectric constant and low dielectric loss tangent! 5G resin, semiconductor applications, foldable materials, Under Display Camera.
We would like to introduce "HFBAPP," which is handled by Seika. In addition to the products listed on our website, we offer a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane ■Chemical Formula: C27H20F6N2O2 ■M.W. (Molecular Weight): 518.45 ■CAS No.: 69563-88-8 ■Melting Point: 160℃ *For more details, please refer to the related links or feel free to contact us.
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【Other Features】 ■Structure: Ether bond/Alkylene group/F ■Production scale: Pilot production *For more details, please refer to the related links or feel free to contact us.
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【Applications】 ■ Transparent Polyimide ■ Resin for 5G Applications ■ Semiconductor Applications ■ Materials for Foldable Devices ■ LCD Materials (Alignment Film, Substrate Film) ■ OLED Materials (Window Film) *For more details, please refer to the related links or feel free to contact us.
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Seika has made aromatic diamines, which are essential raw materials for products such as heat-resistant polyimide resins, its main product. We have earned great trust from customers both domestically and internationally, who say, "For aromatic diamines, choose Seika." Since our founding, we have upheld the corporate philosophy of "Quality First, Cost Reduction, and Research Efforts," striving to provide better products at lower prices in a stable manner while honing our technology. Moving forward, we will further promote safe operations as a fundamental principle, taking into account the SDGs and being mindful of society and the environment. We will not only ensure the stable supply of high-quality products but also accurately capture customer needs and continue our corporate activities with a sense of mission to support customers in the development of new materials and new products.