セイカ Product Lineup

【TPE-R】 Seika's TPE-R is a monomer that has a proven track record in the development of materials, thermoplastic resins, and adhesive resins that achieve low transmission loss (Low Dk/Df) in the high-frequency range. (Features) ■Compound Name: 1,3-Bis(4-aminophenoxy)benzene ■Chemical Formula: C18H16N2O2 ■M.W. (Molecular Weight): 292.33 ■CAS No.: 2479-46-1 ■Melting Point: 116℃ 【BAPP】 Seika's BAPP is a monomer that has a proven track record in the development of materials, thermoplastic resins, rubber crosslinking agents, and raw materials for bismaleimides that achieve low transmission loss (Low Dk/Df) in the high-frequency range. (Features) ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]propane ■Chemical Formula: C27H26N2O2 ■M.W. (Molecular Weight): 410.51 ■CAS No.: 13080-86-9 ■Melting Point: 128℃

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【TPE-R】 Seika's TPE-R is a monomer that has a proven track record in the development of materials, thermoplastic resins, and adhesive resins that achieve low transmission loss (Low Dk/Df) in the high-frequency range. (Features) ■Compound Name: 1,3-Bis(4-aminophenoxy)benzene ■Chemical Formula: C18H16N2O2 ■M.W. (Molecular Weight): 292.33 ■CAS No.: 2479-46-1 ■Melting Point: 116℃ 【BAPP】 Seika's BAPP is a monomer that has a proven track record in the development of materials, thermoplastic resins, rubber crosslinking agents, and raw materials for bismaleimides that achieve low transmission loss (Low Dk/Df) in the high-frequency range. (Features) ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]propane ■Chemical Formula: C27H26N2O2 ■M.W. (Molecular Weight): 410.51 ■CAS No.: 13080-86-9 ■Melting Point: 128℃

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Seika's TFMB is an aromatic diamine containing a biphenyl skeleton and a meta-position trifluoromethyl group. It is a monomer known for its rigidity due to the main chain structure and the introduction of the bulky trifluoromethyl group, making it suitable for the development of low thermal expansion resins and low transmission loss resins (Low Dk/Df). Additionally, fluorinated polyimides using TFMB have been adopted as window films for foldable smartphones, leveraging their high transparency. In addition to circuit board materials, it is also suitable for LCD/OLED materials and flexible/foldable display materials. We handle various aromatic diamines beyond those listed on our website. If you would like samples or a quote, please feel free to contact us! 【Features】 ■Compound Name: 2,2'-Bis(trifluoromethyl)benzidine, 4,4'-Diamino-2,2'-bis(trifluoromethyl)biphenyl ■Chemical Formula: C14H10F6N2 ■M.W. (Molecular Weight): 320.23 ■CAS No.: 341-58-2 ■Melting Point: 182℃

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Seika's 【m-TB-HG】 is an aromatic diamine containing a biphenyl skeleton and a meta-position methyl group. Due to the rigidity of its main chain structure and the introduction of bulky methyl groups, it is a monomer that has a proven track record in the development of low thermal expansion resins (low CTE) and low transmission loss resins (Low Dk/Df). It is suitable not only for circuit board materials but also for semiconductor applications and LCD/OLED components. In addition to those listed on our website, we handle various aromatic diamines. If you would like samples or a quotation, please feel free to contact us! 【Features】 ■Compound Name: 4,4'-Diamino-2,2'-dimethylbiphenyl ■Chemical Formula: C14H16N2 ■M.W. (Molecular Weight): 212.29 ■CAS No.: 84-67-3 ■Existing Chemical Substance Number: 4-803 ■Melting Point: 86, 103℃

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We would like to introduce "HFBAPP," which is handled by Seika. In addition to the products listed on our website, we offer a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]hexafluoropropane ■Chemical Formula: C27H20F6N2O2 ■M.W. (Molecular Weight): 518.45 ■CAS No.: 69563-88-8 ■Melting Point: 160℃ *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

We would like to introduce "BAPP," which is handled by Seika. In addition to the products listed on our website, we handle a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 2,2-Bis[4-(4-aminophenoxy)phenyl]propane ■Chemical Formula: C27H26N2O2 ■M.W. (Molecular Weight): 410.51 ■CAS No.: 13080-86-9 ■Existing Chemical Substance Number: 4-1581 ■Melting Point: 128℃ *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

We would like to introduce "TPE-R," handled by Seika. In addition to the products listed on our website, we handle a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 1,3-Bis(4-aminophenoxy)benzene ■Chemical Formula: C18H16N2O2 ■M.W. (Molecular Weight): 292.33 ■CAS No.: 2479-46-1 ■Existing Chemical Substance Number: 3-4173 ■Melting Point: 116℃ *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

We would like to introduce "m-TB-HG," handled by Seika. In addition to the products listed on our website, we offer a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: m-Tolidine 4,4'-Diamino-2,2'-dimethylbiphenyl ■Chemical Formula: C14H16N2 ■M.W. (Molecular Weight): 212.29 ■CAS No.: 84-67-3 ■Existing Chemical Substance Number: 4-803 ■Melting Point: 86, 103℃ *For more details, please refer to the related links or feel free to contact us.

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We would like to introduce "DPE/ODA," which is handled by Seika. In addition to the products listed on our website, we handle a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 4,4'-Diaminodiphenyl Ether, 4,4'-Oxydianiline ■Chemical Formula: C12H12N2O ■M.W. (Molecular Weight): 200.24 ■CAS No.: 101-80-4 ■Existing Chemical Substance Number: 3-854 ■Melting Point: 191℃ *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing

Our company has received high recognition both domestically and internationally in the field of raw materials for high-performance polymers as a manufacturer of aromatic diamines. To meet the increasingly sophisticated needs of our customers, our group companies have already obtained ISO 9002 certification, and the Kozaka factory has acquired ISO 14001 certification, with other factories gradually following suit. We are committed to establishing a quality assurance system that ensures our customers' peace of mind and trust, while also engaging in environmentally conscious corporate activities. Moving forward, we aim to continue improving productivity and considering the environment, while also focusing more on research and development, and actively challenging ourselves in new products and new fields. 【Business Activities】 ■ Manufacturing and sales of high-performance polymer raw materials, urethane curing agents, various intermediates, and industrial chemicals, as well as procurement of related raw materials. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

We would like to introduce "TFMB," which is handled by Seika. The structure is an aromatic diamine containing biphenyl and meta-position fluorine, suitable for applications such as 5G resins, semiconductor applications, foldable device materials, and LCD/OLED materials. The packaging is 20kg per fiber drum, and the production scale is commercial production. In addition to the products listed on our website, we handle a variety of other products. If you are considering samples or quotes, please feel free to contact us. 【Features】 ■Compound Name: 2,2'-Bis(trifluoromethyl)benzidine, 4,4'-Diamino-2,2'-bis(trifluoromethyl)biphenyl ■Chemical Formula: C14H10F6N2 ■M.W. (Molecular Weight): 320.23 ■CAS No.: 341-58-2 ■HPLC Purity: 99.5% or higher ■Melting Point: 182.0°C or higher *For more details, please refer to the related links or feel free to contact us.

• Contract manufacturing