All halogen-free, compatible with laser heating methods.
Completely Halogen-Free No halogens, including chlorine (Cl) and bromine (Br), are added. It complies with all current halogen-free standards. Prevention of Solder Balls Uses a special activator that enables rapid heating implementation by laser. Reduces sagging during heating and solves the solder ball issue. Stable Dispensing Prevents reactions between flux and powder. Achieves high coating stability even with minimal dispensing. 【Features】 ■ Prevention of solder balls ■ Stable dispensing ■ Compliance with halogen-free standards *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 45~25μm, 38~20μm, 25~15µm ■ Flux content: 14.0±0.5% ■ Flux type: Halogen-free ■ Copper plate and copper mirror corrosion test: No corrosion ■ Halide content: 0% ■ Insulation resistance test: 1.0×10^8Ω or higher *For more details, please refer to the PDF document or feel free to contact us.
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Soldering at ROL0
Detailed information
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Does not contain any halogens, including chlorine (Cl) and bromine (Br). Compatible with all current halogen-free standards.
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Using a special activator that enables rapid heating implementation with a laser. It reduces sagging during heating and solves the solder ball issue.
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It prevents the reaction between the flux and the powder. Even with minimal discharge, it achieves high application stability.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.