Roll to Roll manufacturing by Daikota!
"COP-CF" is a coating material for a plating seed layer that uses COP with excellent high-frequency characteristics. It is suitable for applications such as high-frequency transparent substrates and demonstrates high adhesion strength due to the use of a dedicated plating seed layer. [Adhesion Strength] ■ Peel Strength: 6N/cm or more ■ Notes: 10mm width, 25mm/min, 90-degree peel *For more details, please download the PDF or feel free to contact us.
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【Features of Additive Products】 ■ High precision (ideal wiring cross-sectional shape) ■ High quality (smooth circuit formation using additive methods) ■ High transparency (compatible with transparent mesh antennas with 80% total light transmission) ■ Low cost (further low-cost proposals possible through large-scale production) *For more details, please download the PDF or feel free to contact us.
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Our company handles FPC and rigid FPC used in various industrial fields, supporting the supply of products through a consistent system from design to production and SMT assembly. We do not simply develop from the perspective of an FPC manufacturer; we are starting with the development of cutting-edge materials required for 5G and 6G, making us the only manufacturer capable of providing next-generation printed circuit boards that cannot be realized by other companies.