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  3. 永旺 WINDOWグループ、日本事務所
Electronic Components and Semiconductors
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永旺 WINDOWグループ、日本事務所

EstablishmentFebruary 2010
addressTokyo/Minato-ku/1-2-17 Hamamatsucho, Stork Bell Hamamatsucho 2F
phone03-5776-5878
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last updated:Oct 07, 2021
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永旺 Company Overview

The sales staff and the development and design teams work closely together to provide the best service to our customers.

Our company handles FPC and rigid FPC used in various industrial fields, supporting the supply of products through a consistent system from design to production and SMT assembly. We do not simply develop from the perspective of an FPC manufacturer; we are starting with the development of cutting-edge materials required for 5G and 6G, making us the only manufacturer capable of providing next-generation printed circuit boards that cannot be realized by other companies.

Business Activities

■ Design, manufacturing, and assembly processing of FPC and Rigid Flex ■ Design and assembly of various printed circuit boards and overseas procurement ■ Overseas procurement of electronic components, enclosures, and molded parts Newly developed products ■ COP transparent substrate... Achieved peel strength required by the market ■ High-frequency FPC... Adopted newly developed PI to achieve characteristics equivalent to LCP ■ Transparent FPC... Successfully commercialized with newly developed colorless and transparent PI ■ Ultra-fine FPC... Successfully commercialized with L/S (2μ/2μ) ■ Ultra-precision FPC... Achieved dimensional tolerance of ±0.05 or less with our unique special processing method

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Plating seed layer coating material 'COP-CF' product image
Plating seed layer coating material 'COP-CF'

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Plating seed layer coating material "COP-CF"

Plating seed layer coating material "COP-CF"

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Detailed information

Company name 永旺 WINDOWグループ、日本事務所
Contact addresspostalcode 105-0013 Tokyo/ Minato-ku/ 1-2-17 Hamamatsucho, Stork Bell Hamamatsucho 2FView on map TEL:03-5776-5878 FAX:03-5776-5877
Key PartnersDomestic major set manufacturers
Industry Electronic Components and Semiconductors

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