Roll to Roll manufacturing by Daikota!
"COP-CF" is a coating material for a plating seed layer that uses COP with excellent high-frequency characteristics. It is suitable for applications such as high-frequency transparent substrates and demonstrates high adhesion strength due to the use of a dedicated plating seed layer. [Adhesion Strength] ■ Peel Strength: 6N/cm or more ■ Notes: 10mm width, 25mm/min, 90-degree peel *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
【Features of Additive Products】 ■ High precision (ideal wiring cross-sectional shape) ■ High quality (smooth circuit formation using additive methods) ■ High transparency (compatible with transparent mesh antennas with 80% total light transmission) ■ Low cost (further low-cost proposals possible through large-scale production) *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
Our company handles FPC and rigid FPC used in various industrial fields, supporting the supply of products through a consistent system from design to production and SMT assembly. We do not simply develop from the perspective of an FPC manufacturer; we are starting with the development of cutting-edge materials required for 5G and 6G, making us the only manufacturer capable of providing next-generation printed circuit boards that cannot be realized by other companies.
