Package technology for high-brightness LEDs - ceramics

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last updated：Oct 20, 2021

共立エレックス

We want to respond to our customers' needs for diverse LED packages by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation.

Ceramic packaging technology that responds to advances in LED technology LEDs, as light-emitting devices, are increasingly being adopted not only for lighting applications but also in a wide range of fields such as home appliances, information devices, and medical equipment, with rapid advancements in high brightness and short wavelength. Consequently, various demands are being placed on LED package materials. Our company is advancing development to meet the "diverse customer needs for various LED packages" by leveraging our integrated manufacturing process from ceramic substrate production to printed circuit formation. We are preparing a "diverse lineup" for various applications of LED devices and "heat dissipation measures" aimed at the rapidly advancing high-power LEDs. We are progressing with technology development that can respond to various application possibilities, and we look forward to your inquiries.

Special site - Product/service details - https://pr.mono.ipros.com/kyoritsu-po/product/

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basic information

A lineup of ceramic packages for various LED applications Development product lineup of LED packages To meet the diverse needs of our customers, we are advancing a wide variety of development products utilizing our in-house technology. We look forward to discussing new requests.

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Applications/Examples of results

A lineup of ceramic packages for various LED applications Development product lineup of LED packages In order to meet the diverse needs of our customers, we are advancing a wide variety of development products using our in-house technology. We look forward to discussing new requests. 《For the latest information, please contact us》

Detailed information

Ultra-high reflectance ceramic specification LED package
LED package with micro reflector Achieves a tiny size of 4.0 x 1.0 mm Ideal for side-view mounting
Side view LED circuit board With reflector function Step-shaped reflector using thick film printing method
Rod-shaped LED circuit board
Metal base LED package Uses a high thermal conductivity Cu substrate for the base, and high-reflectivity ceramics for the reflector.
Metal-ceramic material composite LED package uses a Cu substrate on the N-side and a ceramic substrate with Ag wiring on the P-side as the base substrate.
1313LEDPKG
With the increase in brightness (high output) of LED elements, the importance of heat resistance in packaging materials has grown significantly, along with the demand for heat dissipation characteristics. We have received many inquiries regarding heat dissipation measures, particularly about "improving heat dissipation using general alumina ceramic substrates compared to aluminum nitride substrates, which excel in heat dissipation characteristics." Our company has applied unique printed circuit technology to process through-holes in alumina ceramic substrates and fill the through-hole sections with "special silver-based materials," achieving higher heat dissipation effects than typical alumina ceramic substrates. Improvement technology for heat dissipation performance using printed circuit technology Through the heat dissipation improvement technology developed by our company, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates.