Layered technology for breaking the limits of Moore's Law [TSV processing technology]

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last updated：May 16, 2025

M.T.C

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WF processing, creation of test WFs, through wiring boards (interposers), etc.! Various MEMS processing services including EB exposure, DRIE, and anodic bonding.

Our company offers a variety of MEMS (Micro Electro Mechanical Systems) processing services, including EB lithography, DRIE, and anodic bonding, based on our extensive knowledge and experience gained from semiconductor processing. We provide a wide range of services, including development product processing, elemental technology processing, deep silicon etching, and various film deposition. Additionally, we are also engaged in minimal fab. You can check the important issues regarding process technology in TSV formation through PDF downloads. 【Processing Details】 ■ Pre-treatment (RCA cleaning) ■ Film deposition (thermal Si oxidation film, CVD deposition [SiO2, SiN], metal deposition [Al, Al-Si, Al-Cu, Cu, Ti, W, Mo]) ■ Photolithography (contact aligner, stepper, EB lithography) ■ Etching (wet etching, dry etching, DRIE) ■ Electrodeposition (Cu plating, Ni plating, Au plating) ■ Bonding (anodic bonding, metal-metal bonding, plasma activated bonding) *For more details, please download the PDF or feel free to contact us.

Related Link - https://www.mems-technology.com/

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【Business Content】 MEMS-related Business Contract Processing Sensor Product Development Technical Consulting 【Processing Details】 ■Pre-treatment ・RCA Cleaning ■Film Formation ・Thermal Si Oxide Film Formation ・CVD Film Formation: SiO2, SiN ・Metal Film Formation: Al, Al-Si, Al-Cu, Cu, Ti, W, Mo ■Photolithography ・Contact Aligner ・Stepper ・EB Exposure ■Etching ・Wet Etching ・Dry Etching ・DRIE ■Electroplating ・Cu Plating ・Ni Plating ・Au Plating ■Bonding ・Anodic Bonding ・Metal-Metal Bonding ・Plasma Activated Bonding *For more details, please download the PDF or feel free to contact us.