Rich in in-vehicle experience, lineup according to construction methods.
Rich automotive track record For over 15 years since its release, it has been used by many users, including those in the automotive sector. For screen printing - Chip stand-off prevention type "BT02B878C" The metal composition expands the melting point by adding silver to the eutectic solder, preventing the chip stand-off phenomenon. It increases the adhesive properties of the binder, suppressing the movement of small chips. As a silver-containing effect, it also prevents silver dissolution, improving solder joint strength, thereby enhancing mounting quality. - Standard type "BH63B878C" Developed a solder paste that achieves no-cleaning using conventional reflow. Compared to nitrogen reflow furnace compatible solder paste, it exhibits almost the same characteristics, but since the solid content in the flux is slightly higher, there is a minor drawback in pin contact performance. *For more details, please refer to the PDF document or feel free to contact us.*
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basic information
【Specifications】 - Chip Stand-off Type "BT02B878C" ■ Compatible Solder Alloy: Sn62-Pb36-Ag2 ■ Flux Type: MIL-RMA ■ Halide Content: 0.04% ■ Powder Particle Size: 45–25μm ■ Flux Content: 9.5% ■ Copper Plate Corrosion Test: No Corrosion ■ Copper Mirror Corrosion Test: No Corrosion ■ Insulation Resistance Test (Ω): 5.0×10^8Ω or more ■ Migration Test: None Detected - Standard Type "BH63B878C" ■ Compatible Solder Alloy: Sn63-Pb37 ■ Flux Type: MIL-RMA ■ Halide Content: 0.04% ■ Powder Particle Size: 45–25μm ■ Flux Content: 9.5% ■ Copper Plate Corrosion Test: No Corrosion ■ Copper Mirror Corrosion Test: No Corrosion ■ Insulation Resistance Test (Ω): 5.0×10^8Ω or more ■ Migration Test: None Detected *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
Automotive electrical components, home appliances, and consumer product parts.
Detailed information
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It excels in wettability and printing stability, making it compatible with a variety of applications from automotive to consumer products.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.
![Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]](https://image.mono.ipros.com/public/product/image/076/2001003744/IPROS47351692595301770202.png?w=280&h=280)