One-component heat conductive adhesive (developed product)
Thermal conductive adhesive [developed product]
This is an adhesive with high thermal conductivity compared to our conventional adhesives.
The thermally conductive adhesive [developed product] has the following features: [Features] ■ It is a one-component adhesive, making it easy to work with. ■ It has a high thermal conductivity.
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basic information
【Representative Physical Properties】 Appearance: White liquid Viscosity (mPa.s): 265,000 Thermal conductivity (W·mK): 3.4 Tensile shear adhesion strength (N/cm² SPCC): 1,100
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Applications/Examples of results
【Application】 ■ It is suitable for bonding components that require thermal conductivity and heat dissipation.
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Download All Catalogs![One-component heat-releasing epoxy adhesive [developed product]](https://image.mono.ipros.com/public/catalog/image/01/625/699544/IPROS36004380547745333475.jpeg?w=120&h=170)
![Adhesive for Electrical and Electronic Components [FC Hard]](https://image.mono.ipros.com/public/catalog/image/01/e2c/594481/IPROS83008008108418580787.jpeg?w=120&h=170)
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Company information
Our company develops, manufactures, and sells epoxy and acrylic resin-based adhesives. Our resin products are used in various fields, from bonding and protecting electronic components to fixing and adhering civil engineering materials. Each product is unique, and we respond to customer requests through development and customization. If you have requests or concerns such as "I want an adhesive with specific features" or "I can't find what I want in mass-produced items," please feel free to consult with us! Additionally, our company is committed to creating and managing products with consideration for environmental substance regulations. With our meticulous and speedy response, we support your development and production. For more detailed product information, please visit our corporate website via the "Official Site" link at the top left or the URL below. https://www.resinous-kasei.co.jp/