An excellent vision system equipped with continuous zoom magnification! A twin dicing device with two touch screens.
The ADT Corporation's "8030 Series" is a twin dicing machine capable of cutting semiconductor wafers up to 12 inches in diameter with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high efficiency in processing. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Bridge-type frame - Flexibility – supports hubs with a maximum outer diameter of 3 inches and hubless blades - Dual microscopes, fixed non-contact sensors, and two dress stations - High-output spindles of 1.8kW or 2.2kW - Excellent vision system with continuous zoom magnification - Intuitive operating interface using a large 19-inch touch screen monitor *For more details, please refer to the PDF document or feel free to contact us.
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**Main Features (Partial)** ■ High dicing process speed - lowest cost ■ Supports products up to 12 inches x 12 inches square ■ Industrial PC based on Win10 OS ■ Air bearing feed axis (X) ■ Quick and simple blade replacement with spindle shaft locking mechanism ■ High-speed automatic alignment and cut positioning to improve throughput *For more details, please refer to the PDF document or feel free to contact us.*
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【Main Applications】 ■ Silicon wafers for memory and logic products ■ MEMS (Micro-Electro-Mechanical Systems) ■ CMOS Image Sensors (CIS) ■ Packaging (FOPLP, FOWLP, QFN, BGA) *For more details, please refer to the PDF document or feel free to contact us.
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