Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.
We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.
Inquire About This Product
basic information
Most of the prototype development projects we are involved in are conducted under strict confidentiality obligations. With over 1,000 prototype achievements accumulated over the past 10 years, we believe we can provide proposals that align with our customers' needs based on our expertise in stamping. "I want to do something like this..." That's all we need. Just leave the rest to us. If processing methods or equipment other than ours are the best for our customers, even if it means higher costs for us, we will honestly and unhesitatingly propose the optimal solution. We believe this approach fosters a long-term relationship that is not solely bound by costs and benefits all parties involved. We would greatly appreciate it if you could share any concerns or challenges you have regarding stamping.
Price range
Delivery Time
Applications/Examples of results
5G-compatible substrate
Company information
In mold technology, we established a mass production method for copper heat dissipation substrates for power semiconductors in 2012. Products made of laminated copper and heat dissipation resin are not allowed to have any burrs on the cross-section, requiring strict processing cross-section quality and management capabilities. Therefore, we successfully developed and introduced molds using sintered diamond, making our manufacturing technology the key to product realization. Additionally, we have consolidated daily process management, such as micro-observation records of cross-sectional shapes, a quality assurance system that allows for full inspection by inspectors and automatic visual inspection machines, and a production management system that directly supplies to end users, proudly positioning ourselves as a "trusted processing partner."
![[Research Material] Global Market for PCBs (Printed Circuit Boards)](https://image.mono.ipros.com/public/product/image/2a2/2001463882/IPROS10368197253080598181.jpeg?w=280&h=280)
