サンコー技研 Company Overview

Total service for "Punching" - Providing overwhelming competitiveness with five cutting-edge technologies: molds, lasers, ultrasonics, robots, and rolls.

In mold technology, we established a mass production method for copper heat dissipation substrates for power semiconductors in 2012. Products made of laminated copper and heat dissipation resin are not allowed to have any burrs on the cross-section, requiring strict processing cross-section quality and management capabilities. Therefore, we successfully developed and introduced molds using sintered diamond, making our manufacturing technology the key to product realization. Additionally, we have consolidated daily process management, such as micro-observation records of cross-sectional shapes, a quality assurance system that allows for full inspection by inspectors and automatic visual inspection machines, and a production management system that directly supplies to end users, proudly positioning ourselves as a "trusted processing partner."