3D printer + precision burr-free pressed products (bus bars, lead frames)
Insert molding + press molding alternative method → With 3D printers + precision press parts, it is a new era of manufacturing methods that do not require molds! Currently, we are receiving inquiries from various fields! Please feel free to consult with us!
Inquire About This Product
basic information
Aiming for new manufacturing!
Price range
Delivery Time
Applications/Examples of results
- Development of power control system devices for EVs - Development of busbar modules and connectors - Development of wearable modules and sensors
Company information
In mold technology, we established a mass production method for copper heat dissipation substrates for power semiconductors in 2012. Products made of laminated copper and heat dissipation resin are not allowed to have any burrs on the cross-section, requiring strict processing cross-section quality and management capabilities. Therefore, we successfully developed and introduced molds using sintered diamond, making our manufacturing technology the key to product realization. Additionally, we have consolidated daily process management, such as micro-observation records of cross-sectional shapes, a quality assurance system that allows for full inspection by inspectors and automatic visual inspection machines, and a production management system that directly supplies to end users, proudly positioning ourselves as a "trusted processing partner."
