High-rigidity multi-stage press for cover film lamination
This is a model suitable for small-batch production of various types, using a high-rigidity multi-stage press for bonding cover films of flexible printed circuit boards (FPC).
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basic information
【Features】 ● The entire device is covered with a cover for dust prevention and safety measures. ● Area sensors are also installed for more reliable safety. ● Innovations in the release mechanism and cushion material mounting fixtures. *For more details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
Cover film bonding for FPC (Flexible Printed Circuit Board)
Company information
Our company has been involved in the design and manufacturing of production equipment and testing devices for various industries, including electronics, ceramics, and powder technology. Our products are widely adopted both domestically and in Southeast Asia. We are committed to reflecting your opinions and requests, and we will always strive to propose the best systems and production lines.
![Hot Press (Molding Type) [Hydraulic Press]](https://image.mono.ipros.com/public/product/image/70e/2000417182/IPROS87296704990785079386.jpeg?w=280&h=280)
