It is possible to bundle optical fibers without using adhesive! It has excellent heat resistance and can be used in high-temperature environments.
"Bundle Fiber" can bundle multiple optical fibers without the use of adhesives by employing jacket technology. Due to its adhesive-free structure, it can be used in high-temperature environments. When creating jacketed bundle fibers, discharge, resistance heating furnaces, and micro-torches are used as heat sources, and the heat source is selected according to the outer diameter dimensions during bundling. 【Features】 ■ Adhesive-free, excellent heat resistance, suitable for high-temperature environments ■ Bundling of optical fibers in any desired arrangement is possible ■ The arrangement of optical fibers can be a hexagonal dense structure, and arbitrary arrangements are possible using dummy rods ■ Treatments such as AR (anti-reflective) coating can be applied to the ends of the optical fibers ■ Support for two-dimensional arrangements is also possible (bundle end - two-dimensional arrangement) *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - The fixation of adjacent optical fibers is done through heat melting without the use of adhesives, ensuring high heat resistance and reliability. - The numerical aperture (NA), core and cladding diameter, number of fibers in the bundle, jacket material, and outer diameter of the optical fibers used for bundling can be customized according to your specifications. - The standard number of fibers in a bundle ranges from 2 to 61. - For bundles with more than 62 optical fibers or if there are specific requirements for the fibers used, please consult us separately. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.
