Introducing examples of free-form wiring implemented using a jet dispenser.
We would like to introduce a case study of our response to material manufacturers. We developed high-performance materials such as flexible, stretchable, and millimeter-wave materials. When being evaluated, they faced challenges such as forming wiring on films, low-temperature mounting on thermally fragile materials, and the desire to evaluate not just the materials alone but also with chips mounted. To address these issues, we conducted free-form wiring using a jet dispenser, developed optical transceiver methods, and evaluated millimeter-wave substrate materials compatible with 5G. [Case Overview] - Free-form wiring using a jet dispenser - Development of optical transceiver methods - Realization of compact AOC through FPC with integrated optical waveguides - Evaluation of 5G-compatible millimeter-wave substrate materials *For more details, please refer to the PDF document or feel free to contact us.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.