Compatible with φ8" to φ12" wafers! In-situ pad conditioning is possible during CMP processing.
The LGP-712 is a product that supports the development of high-precision technology for wafers ranging from φ8" to φ12". It is equipped with two polishing heads to accommodate device flattening CMP. It is also suitable as an experimental machine for the research and development of pads and slurries. Our company offers many options to meet customer needs, including support for metal CMP such as Cu-CMP. 【Features】 ■ Capable of ultra-precision polishing ■ Equipped with two polishing heads to accommodate device flattening CMP ■ Supports metal CMP such as Cu-CMP ■ Also suitable as an experimental machine for research and development *For more details, please refer to the PDF document or feel free to contact us.
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Our company offers a wide range of services including the manufacturing and sales of polishing equipment, consumable materials, machine design, electrical design and production, equipment maintenance, and contract polishing processing. We have accumulated extensive experience, including lapping and polishing of semiconductors, compound semiconductors, and oxides, allowing us to propose polishing processes to our users.