Development of materials that achieve low thermal expansion (low CTE) and low transmission loss (Low Dk/Df) in the high-frequency range!
Seika's 【m-TB-HG】 is an aromatic diamine containing a biphenyl skeleton and a meta-position methyl group. Due to the rigidity of its main chain structure and the introduction of bulky methyl groups, it is a monomer that has a proven track record in the development of low thermal expansion resins (low CTE) and low transmission loss resins (Low Dk/Df). It is suitable not only for circuit board materials but also for semiconductor applications and LCD/OLED components. In addition to those listed on our website, we handle various aromatic diamines. If you would like samples or a quotation, please feel free to contact us! 【Features】 ■Compound Name: 4,4'-Diamino-2,2'-dimethylbiphenyl ■Chemical Formula: C14H16N2 ■M.W. (Molecular Weight): 212.29 ■CAS No.: 84-67-3 ■Existing Chemical Substance Number: 4-803 ■Melting Point: 86, 103℃
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【Other Features】 ■Structure: Biphenyl ■Packaging: 25kg/Fiber Drum ■Production Scale: Commercial Production
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【Usage】 ■ Polyimide film ■ Dye pigment intermediate
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Seika has made aromatic diamines, which are essential raw materials for products such as heat-resistant polyimide resins, its main product. We have earned great trust from customers both domestically and internationally, who say, "For aromatic diamines, choose Seika." Since our founding, we have upheld the corporate philosophy of "Quality First, Cost Reduction, and Research Efforts," striving to provide better products at lower prices in a stable manner while honing our technology. Moving forward, we will further promote safe operations as a fundamental principle, taking into account the SDGs and being mindful of society and the environment. We will not only ensure the stable supply of high-quality products but also accurately capture customer needs and continue our corporate activities with a sense of mission to support customers in the development of new materials and new products.