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Our company manufactures various functional liquid encapsulants, primarily for applications such as control board encapsulation and sensor module sealing, as well as high heat-resistant and heat shock-resistant encapsulants that have a proven track record in various power module applications. We offer a wide range of products, including heat-resistant, waterproof, insulating, and flame-retardant types. Please feel free to contact us if you have any inquiries. 【Purpose of Use】 ■ Protection from external environments such as humidity ■ Fixation of components ■ Improved heat dissipation and prevention of internal heat accumulation ■ Insulation protection ■ Prevention of stress from impacts, friction, and vibrations *For more details, please download the PDF or contact us.
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【Lineup】 ■ Encapsulation for electronic components (heat-resistant, waterproof, insulating, flame-retardant) ■ High heat-resistant and heat shock-resistant encapsulants ■ Encapsulation for circuit boards (heat dissipation) ■ Base resin for magnetic material formulation (liquid type) ■ Functional adhesives and others *For more details, please download the PDF or contact us.
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Our company takes pride in our technology that allows us to create products that can finely respond to the diverse needs of our customers in the field of thermosetting resins, and we are continuously engaged in research and development. Specifically, we focus on thermosetting liquid formulations and high-performance thermosetting resin molding materials as our core business, striving to thoroughly pursue market needs while aiming for research and development of new technologies that will serve as a foundation for anticipated trends. Please feel free to contact us if you have any inquiries.