McDermid "HiTech Resin Products" Corner Bond, etc.
McDermid Performance Solutions Japan, Inc.
Introducing products such as one-component thermosetting resins, one-component types, medium temperature range, and fast thermosetting options!
Seiwa Co., Ltd. handles "HiTech resin products" manufactured by McDermid. Founded in 1872, this American manufacturer has a global network and a wide adoption record under unified quality standards worldwide. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. Our product lineup includes epoxy materials for dispensing at BGA edges and corners called "Corner Bond," as well as one-component types, medium-temperature, and fast-curing "Potting Agents." "Underfill" is suitable for protecting solder joints of BGA, CSP, and flip-chip components. For more details, please refer to the related catalog. 【Product Types (Partial)】 ■ Underfill: High-speed penetration, thermal cycle resistance, etc. ■ Corner Bond: Adhesion at edges and corners ■ Potting Agent: Prevents cracks in small components *For more information, please refer to the PDF materials or feel free to contact us.
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【Product Lineup】 <Underfill> ■ALPHA HiTech CU31-2030 ■ALPHA HiTech CU21-3240 ■ALPHA HiTech CU13-3150 <Corner Bond> ■ALPHA HiTech CF31-4010 ■ALPHA HiTech CF12-4485B <Potting Compounds> ■ALPHA HiTech 4210 Series *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.
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