It is a non-eutectic low melting point solder paste for low thermal resistance substrates, components, and large warped semiconductor parts!
The "HRL1 OM-550" is a low melting point solder paste. It is designed to improve yield and reduce component warpage, significantly enhancing the drop shock resistance and thermal cycling resistance, which were weaknesses of conventional low melting point solders. The melting point is significantly lower compared to "SAC305," achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. 【Features】 ■ Board life: Continuous printing possible for up to 12 hours ■ Achieves low voids with various packages such as BGA, MLF, and DPAK ■ Dramatically improves macro (H.I.P) defects and NWO (Non-Wet Open) defects through low melting point reflow ■ Compatible with both atmospheric and N2 reflow ■ Adaptable to components using SAC305 alloy *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Product Features Summary (Excerpt)】 ■ Printing Process - Micro-printability - Plate life - Compatible printing speed ■ Reflow Process Yield - Reflow atmosphere - Low voids - Reduced mounting defects ■ Electrical Reliability - SIR - Flux classification ■ Environmental Compliance - Halogen content *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
The development of electronics has given people great dreams and has turned those dreams into reality, one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and delighted to have been able to engage in work that contributes to this segment of the electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can help realize humanity's great dreams and support the product and information development of our clients. I am committed to walking alongside our clients and growing together in the information society of the 21st century. However, on the other hand, global environmental issues have become increasingly prominent. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental value of humanity. I am determined to strive towards becoming a company that harmonizes with nature and society as we move towards an endless future.
![[Seminar] Selecting Paste Based on the Deterioration State of Solder Paste](https://image.mono.ipros.com/public/product/image/2115080/IPROS2581515875150251039.png?w=280&h=280)