High thermal conductivity & low elasticity aluminum-based printed circuit board material AC-7302
AC-7302
Effective measures against solder cracks.
When surface mount components are soldered onto an aluminum base printed circuit board, the aluminum plate repeatedly expands and contracts due to heat, causing stress to accumulate at the solder joints, leading to fatigue failure (solder cracks). The insulation layer of AC-7302 is very soft (low elasticity), which can help alleviate the stress on the solder joints.
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basic information
The storage elastic modulus of the insulating layer (DMA/25°C) is 0.08 gigapascals. The thermal conductivity of the insulating layer is 2 W/mK. The glass transition temperature (DMA) of the insulating layer is 165°C. It has excellent long-term heat resistance. It has excellent moisture resistance.
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Applications/Examples of results
Aluminum base printed circuit boards that require measures against solder cracks.
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| Model number | overview |
|---|---|
| AC-7302 |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
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