High reliability substrate

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last updated：Jan 31, 2024

松和産業本社

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Manufacturing management of the core components of printed circuit boards (through-holes, pattern formation, resist exposure)

We would like to introduce our "High Reliability Boards." Pattern formation and resist exposure utilize the new DI (Direct Imager) method, achieving L/S = 40/40μm and resist position accuracy of 15μm. We have also quickly adopted inkjet for silk printing, successfully achieving a character height of 500μm, a character width of 90μm, and a position accuracy of 20μm. Our company is a manufacturer that thoroughly manages a wide variety of new equipment and chemicals, delivering high reliability boards faster than anyone else. We ensure high reliability and long lifespan, comply with delivery deadlines, and provide rapid analysis in case of troubles. 【Features】 ■ Pattern formation and resist exposure use the new DI method ■ Early adoption of inkjet for silk printing ■ Thorough management of a wide variety of new equipment and chemicals ■ High reliability and long lifespan, compliance with delivery deadlines, and rapid analysis in case of troubles *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.showanet.jp/product/5/

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【Manufacturing Management】 <Management of Through Holes (TH)> ■ Daily maintenance of drill and laser equipment ■ Management of copper plating solution and observation of TH cross-section ■ Regular reliability testing by external analysis manufacturers - Optical microscope observation - SEM observation - Thermal shock testing (-65℃ to 125℃ for 100 cycles) - Hot oil testing (260℃ to 20℃ for 100 cycles) - Flame retardant testing - Pattern peel strength testing - TH pull-out testing - Physical property management <Management of Patterns & Resist> ■ Maintenance of various equipment - Thorough management of chemical solutions by comparing internal manual analysis with manufacturer analysis - Stable etching through concentration management using a bareback system <Other Management> ■ Regular measurement of the thickness of electroless gold flash, electrolytic gold, and flux ■ Additionally, support for customers' risk management through the provision of information on domestic and international related regulations and investigation and disclosure of chemical substances contained in product specifications *For more details, please refer to the PDF document or feel free to contact us.