Achieve efficient surface treatment with an atmospheric pressure plasma device! Easily change the captured particle size with a bag filter.
We have developed a method that can efficiently handle the dispersion of particles, hydrophilization of particles, and surface reduction of metal particles using an atmospheric pressure plasma device. By utilizing a structure that takes advantage of a downstream type processing method suitable for wide and long workpieces, we are able to trap radicals inside the cavity and stir them with the workpiece, enabling more efficient surface treatment. Since we completely eliminate electrical and electromagnetic wave damage, as well as UV damage to the workpiece, there is no damage to the surface of the workpiece, and surface modification of metal particles is also achieved. As a result, there is no charge buildup on the workpiece after processing. 【Features】 ■ Downstream type suitable for wide applications ■ Structure that leverages advantageous processing methods for long workpieces ■ Complete elimination of electrical, electromagnetic wave, and UV damage to the workpiece ■ Plasma irradiation width can be produced in the range of 100mm to 2000mm *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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【Other Features】 - The amount of UV and Deep UV light during plasma generation is reduced to about 1/80 compared to conventional methods. - There are no changes in the intermolecular crosslinking characteristics or damage within the workpiece. - Due to ion acceleration control and suppression of the sputtering effect within the discharge electrode, there is no particle generation. - The dielectric electrode can be used semi-permanently, reducing running costs. - Processing on semiconductor chips is also possible (no changes in transistor characteristics after processing <L/S of 4nm or more>). - A structure (patented) that minimizes the distance between the plasma generation area and the workpiece achieves high performance. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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*For more details, please refer to the materials. Feel free to contact us as well.*
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.
