Introducing diamond wrapping film suitable for fine polishing using fixed abrasives.
We would like to introduce our product "NEO." This product is a diamond wrapping film that can be used for fine polishing with fixed abrasive particles. We offer particle sizes of 0.5μm, 2μm, and 9μm. For more details, please refer to the related catalog. 【Sizes】 ■203 ■229 ■154 ■305 *For more information, please refer to the PDF document or feel free to contact us.
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basic information
【Particle Size】 ■0.5μm ■2μm ■9μm *For more details, please refer to the PDF document or feel free to contact us.
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Sample grinding *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.
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