Introduction of research project results on ultra-hard alloy powder for 3D additive manufacturing.
[Case Study of 3D Printer Development Initiatives] Introducing the achievement of producing ultra-hard punches with internal piping, with over 100,000 shots in actual use.
In the "Knowledge Base Aichi Key Research Project" implemented by Aichi Prefecture and the Public Interest Incorporated Foundation Science and Technology Exchange Foundation, a research group consisting of Professor Makoto Kobashi from Nagoya University, Asahi Seiki Kogyo Co., Ltd., Aichi Industrial Science and Technology Comprehensive Center, and our company has successfully developed a mold for cemented carbide with internal structures using a 3D printer. We are currently fabricating cemented carbide punches with internal piping using a 3D printer, and for verification, we are using the actual fabricated cemented carbide punches in deep drawing processing. We have confirmed that there are no abnormalities in both the workpiece and the punch even after 100,000 shots, and further verification with an increased number of shots is planned for the future. Our company has developed powders with properties suitable for metal 3D printers (Powder Bed Fusion: PBF) necessary for fabricating using cemented carbide powders. The manufacturing and sales of these 3D printer-compatible cemented carbide powders have already begun. The cemented carbide punch shown in the image was fabricated by Japan Layered Manufacturing Co., Ltd.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
