We will accommodate special specifications tailored to existing devices, starting with the cathode introduced from the φ19 compression port.
The "Magnetron Sputter Source" is a sputtering cathode for film formation of metals, oxides, semiconductors, and more. Starting with the standard type φ19 compression port cathode, it can be customized to fit existing equipment. We design gas introduction nozzles, shutters, particle mitigation shields (PG shields), and ultra-high vacuum compatibility according to customer needs. 【Features】 ■ For film formation of metals, oxides, semiconductors, etc. ■ Designed to meet customer needs *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Target Size: φ2 inches ■ Magnet: Nd/FeB ■ Maximum Power (DC): 1000W ■ Maximum Power (RF): 400W ■ Voltage: 200–1000V ■ Maximum Current: 3A ■ Sputtering Pressure: 0.3Pa–60Pa ■ Cooling: Water cooling 2l/min ■ Options: Shutter, PG shield, oblique incidence type, horizontal introduction type, swivel type, ultra-high vacuum compatible *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Our company designs and manufactures vacuum components and mechanisms, as well as equipment production and maintenance. We also accept modifications of existing equipment. Please feel free to consult us regarding vacuum equipment.