Leave the downsizing of silicon wafers to us!
Our company has been focusing on downsizing silicon wafers with the desire to "make efficient use of limited materials" while being mindful of the environment. We use large-diameter wafers until they are re-polished and made thinner, and then we downsize them to minimize waste and promote reuse. Please feel free to contact us if you have any requests. 【Process of Silicon Wafer Downsizing】 1. Downsizing 2. Heat treatment 3. Edge beveling 4. Lapping 5. Cleaning and inspection 6. Shipping *For more details, please download the PDF or contact us.
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【Other Processing Services (For those who wish)】 ■ Etching Processing ■ Polishing Processing *For more details, please download the PDF or contact us.
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Since our establishment, we have been committed to environmental considerations and have focused on downsizing silicon wafers. Leveraging over 50 years of technology and experience, we excel at cutting efficiently from large diameter (12-inch) to small diameter (especially 4-inch and 6-inch) wafers. Additionally, through collaboration with mirror finish processing companies, we can provide high-quality dummy wafers for prototyping to those involved in research and development.