江戸川電子 Company Profile

Leave the important resources to the end! For wafer size reduction processing, trust our company.

Since our establishment, we have been committed to environmental considerations and have focused on downsizing silicon wafers. Leveraging over 50 years of technology and experience, we excel at cutting efficiently from large diameter (12-inch) to small diameter (especially 4-inch and 6-inch) wafers. Additionally, through collaboration with mirror finish processing companies, we can provide high-quality dummy wafers for prototyping to those involved in research and development.