Enhancing the stack-up design process of printed circuit boards with high-precision field solvers, loss planning environments, and a complete library of dielectric materials.
The issue of stack-up is one of the main causes of board respins that everyone wants to avoid. Among the many stack-up tools available, only Z-planner Enterprise can enhance the stack-up design process with high-precision field solvers, loss planning environments, and a complete library of dielectric materials, all of which interface seamlessly with widely used signal integrity software. As edge rates become increasingly faster, accurate calculations of loss and impedance using real dielectric material data are essential for correctly designing the stack-up from the outset. 【Features】 • Integration of HyperLynx field solver • Unlimited number of layers and impedance groups • Advanced stack-up wizard • Compare stack-ups from various fabs against specifications and ensure DFX rules are applied • Consideration of glass properties to mitigate shifts caused by glass weaving • Import stack-ups from the manufacturing department with detailed manufacturing properties added *For more details, please download the PDF or contact us.
Inquire About This Product
basic information
Advantages • The automation of supplier stack-up design certification ensures that the manufactured stack-ups meet design and manufacturing requirements. • Having a unified repository and methodology reduces the time required for reusing stack-up designs and enforces best practices across the organization. • Utilizing comprehensive support functions for CCL material selection allows for the selection of the optimal multilayer material system for the design. • Cost management and Value Engineering (VE) maximize profitability. • Sending accurate stack-up data to signal integrity analysis tools early in the design process enables valid simulations.
Price range
Delivery Time
Applications/Examples of results
Z-planner Enterprise Product Features • Everything needed for automated design and management of PCB stack-ups, including the stack-up wizard, and selection of multilayer materials • Interface with major PCB layout and signal integrity design flows • Design rule management and checks for DFM and DFSI • Unlimited corresponding stack-up layer counts, including automatic calculation of target impedance width/spacing • HyperLynx field solver - simulation of dielectric loss and copper loss • Z-solver - detailed cross-section analysis including export of S-parameters
catalog（1）
Download All Catalogs
Company information
Siemens EDA, a division of Siemens Digital Industries Software, is a technology leader providing software and hardware for EDA (Electronic Design Automation). By offering proven software tools and industry-leading technology to address challenges in design and system-level scaling, Siemens EDA ensures more predictable outcomes during the transition to next-generation technology nodes. A closed-loop digital twin managing the silicon lifecycle enables the seamless movement of data for chips, substrates, and electrical/electronic (E/E) systems across various domains such as design, manufacturing, and the cloud. Siemens' commitment to openness and industry collaboration fosters collaboration and interoperability within the EDA and electronics ecosystem. Siemens is where EDA meets tomorrow.
![[Technical Document] Preventing Knowledge Loss: Knowledge Transfer in the Automotive/Aerospace Industry](https://image.mono.ipros.com/public/product/image/dd7/2000119378/IPROS617800560283128558.jpg?w=280&h=280)
![[Electric Craftsman NX Implementation Case] The usability of mouse operations and other features suits me well.](https://image.mono.ipros.com/public/product/image/ab1/2001486622/IPROS86650871531047606341.png?w=280&h=280)
![[Case Study of Electric Craftsman NX] Compared products from three companies and decided on ANDES Electric Craftsman.](https://image.mono.ipros.com/public/product/image/d3a/2001486617/IPROS82573028031693913334.png?w=280&h=280)
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
