シーメンスEDAジャパン Company Overview

In this webinar, we will provide a detailed introduction to the main features of the new user experience/user interface (UX/UI) of Xpedition 2409, scheduled for release in September 2024, as well as the differences from previous versions and key points for implementation. How will the intuitive and user-friendly new UI, which sets itself apart from the previous Xpedition UX, change the design/analysis/verification flow? Xpedition 2409 will unify the UX/UI that has traditionally varied between tools. The cumbersome navigation between tools that felt like a different world will become a thing of the past, supporting the design work of users operating across multiple domains. Additionally, the newly integrated AI features will provide timely recommendations for the next necessary actions through command predictions. These UX/UI innovations will transform electronic system design, allowing for an entirely new level of operability to be experienced.

In recent years, the challenges of EMI (Electromagnetic Interference) measures in electric vehicles (BEVs) have become more complex, and various research, analysis, and countermeasures are being undertaken to address these issues. In this webinar, we will introduce a model-based simulation verification method that qualitatively evaluates EMI behavior, which could not be visualized using traditional vehicle-based system-level simulations, by coupling more detailed electronic device models with models extracted from various CAE tools. This verification method comprehensively models the electrical and electromagnetic interactions of various components related to the powertrain of BEVs (such as batteries, motors, inverters, and harnesses) and evaluates EMI behavior through a common simulation platform. Additionally, by understanding the EMI effects in the high-voltage and high-frequency environment of BEVs, we provide solutions that contribute to problem-solving during the design phase.

In today's world of accelerated signals, there is a demand for higher precision simulations. However, increasing precision also leads to longer analysis times, and determining the optimal design often requires time-consuming visual assessments of each simulation result. To address these challenges, using Siemens' HyperLynx DSE allows for comprehensive visualization of all results, enabling faster extraction of the optimal design, and seamlessly reflecting the extracted model into the layout. In this webinar, we will introduce a series of topics using HyperLynx SI and HyperLynx Advanced Solver from the HyperLynx printed circuit board design analysis product line, covering parameter settings, output of analysis results, optimization of 3D differential via structures using HyperLynx DSE, and verification of their effects, all illustrated with specific operations based on PCI-Express.