COM-HPC compliant CPU module with Intel Tiger Lake UP3 (Client)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
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basic information
★ Equipped with Intel 11th Gen Core/Celeron CPU ★ Built-in Intel Iris Xe Graphics Core Gen12 GPU ★ DDR4 SO-DIMM with 2 slots, IBECC support, up to 64GB ★ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; up to 2x 2.5GbE
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Applications/Examples of results
Construction machinery, measuring instruments, transportation, medical devices, retail.
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Company information
SECO (listed on the Italian Stock Exchange, ticker code IOT) is an Italian manufacturer with over 40 years of experience in the design and production of embedded edge devices and solutions. It offers a variety of solutions ranging from embedded CPU modules, motherboards, panel PCs, and box PCs to fully customized PCs that integrate hardware and software. SECO is not just a hardware manufacturer; its self-developed cloud service, CLEA, serves as an environment for AI/IoT development and also includes features for remote management and data collection, adding more value to edge devices. The group employs about 800 people worldwide and has five production sites, nine development centers, and sales offices in nine countries, providing products and services to leading companies in over 300 industries, including healthcare, factory automation, aerospace and defense, fitness, and retail. SECO's development team strategically builds long-term partnerships with big tech companies while collaborating with universities, research institutes, and startups. Corporate Social Responsibility (CSR) is also part of SECO's policy, and the company has taken several actions to reduce environmental impact, consistently appealing to people and communities with this commitment.
