Several workers with over 10 years of experience, including one J-STD specialist, are on staff!
We respond to various needs for "manual assembly" at K-All, with highly qualified technicians performing the work responsibly. We can also handle special materials such as flexible substrates and those with high heat dissipation, including aluminum and ceramics. Additionally, we can accommodate a wide range of components, from 0.4mm pitch connectors and QFPs to microchips. You can also rely on us for reflow-incompatible components, including PWBs larger than 500mm, with a thickness of over 4mm, as well as components with varying heights and heat resistance. 【Features】 - Capable of manual assembly for 0201 chips - Manual soldering for connectors and QFPs with a narrow pitch of 0.4mm - Capable of manual assembly for high-difficulty components - Manual assembly for flexible substrates is also possible - Supports both eutectic solder and lead-free solder *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
Efforts to Create Quality Products ■ Based on soldering conditions, work is carried out in an organized environment where workbenches and tools are identified and arranged. ■ By creating unique drawings, all stakeholders can efficiently and safely grasp the implementation details at a glance. ■ A single inspection of each implementation is conducted at every stage. ■ Solder inspection within the process is conducted before handing over to the next stage. ■ Devices and circuit boards that are sensitive to moisture are managed with MacDry before implementation. *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
【Proven Track Record】 ■0402 Chip ■0201 Chip *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.