We accept orders at any stage and for any process, including "hand fitting" and "press fit"!
The printed circuit board assembly is divided into various processes, but at our company, we can respond with a one-stop service, of course, and we are capable of handling any stage or process at any time. With the technical skills we have cultivated since our founding, we can accommodate "hand soldering" for small components, as well as "press-fit" using specialized tools, "shipping inspection (using inspection machines)," and "underfill removal and application." Please feel free to contact us when you need our services. 【Examples of Contracted Processes (Excerpt)】 ■ Hand soldering ■ Hand placement ■ Mounter ■ Modification ■ Correction *For more details, please refer to the PDF document or feel free to contact us.
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【Other Process-Specific Contract Examples】 ■ Press Fit ■ Cleaning ■ Assembly and Testing ■ X-ray Inspection ■ Shipping Inspection (Using Inspection Equipment) ■ Underfill Removal and Application ■ Substrate Division *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
![[Technology and Achievements] Setting Manufacturing Methods According to Development Stages](https://image.mono.ipros.com/public/product/image/2be/2000706935/IPROS02497301798528559817.png?w=280&h=280)
![BGA Reballing [Presentation of technical materials for BGA reballing and rework]](https://image.mono.ipros.com/public/product/image/647/2000712771/IPROS82688767437824773084.png?w=280&h=280)