A team of professionals in substrate assembly! Leave it to us for lead-free, eutectic, various types, small quantities, short delivery times, and express services.
We perform accurate "manual placement" using our unique K-OHL drawings. Implementation of components from 0402 chips to QFPs, connectors, and BGAs is also possible. We have numerous achievements in aerospace and defense-related fields. Depending on the soldering conditions, we identify not only the workbench but also tools, and carry out work in an organized environment. 【Features】 ■ Support from a single piece ■ Manual placement possible with a dispenser even without a metal mask ■ Various components, including BGAs, can be manually placed using rework machines ■ Implementation is possible even without mounting data ■ Suitable for loose components ■ Manual placement on flexible substrates is also possible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Efforts to Create Quality Products ■ Based on soldering conditions, we identify and organize the workspace, tools, and other equipment to ensure a well-prepared environment for work. ■ By creating unique drawings, we incorporate an efficient and safe system that allows all stakeholders to grasp the implementation details at a glance. ■ A thorough inspection of each implemented board is conducted at every stage. ■ Solder inspections are performed within the process before handing over to the next stage. ■ Devices and circuit boards that are sensitive to moisture are managed with MacDry before implementation. ■ Work is conducted under stable reflow conditions using nitrogen generated by a nitrogen generation system. *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
[Proven Track Record] - Expertise in creating reflow temperature profiles suitable for various substrates - Capable of mounting BGA and QFN packages - High-difficulty assembly for aerospace and defense-related applications *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
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