Achieving non-destructive testing for BGA and CSP! As part of our pursuit of high quality, we have established detailed inspection standards.
To maintain the quality of products that cannot be visually inspected after reflow, we conduct checks using 'X-ray inspection.' In pursuit of high quality, we have established detailed inspection standards. These are critical items that determine the quality of the products. We perform inspections on all components that cannot be visually inspected, such as BGA, QFN, SON, DFN, LGA, and connectors. 【Features】 ■ Achieves high resolution and high density analysis capabilities with the X-ray TV inspection device (Softex WORK-LEADER 90). ■ Detailed inspection standards are set in pursuit of high quality. ■ Critical items that determine the quality of the products. *For more details, please refer to the PDF document or feel free to contact us.
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【Features of the Equipment】 ■ X-ray TV Inspection Device "WORK-LEADER 90" (manufactured by Softex) - Equipped with a soft X-ray camera - Achieves high resolution and high density analysis capabilities - Wide zoom mechanism from low to high magnification - Compatible with L size *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Maintaining product quality *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.