Leave the difficult substrate assembly, such as high multilayer and high current boards, flexible boards, and aluminum boards, to us.
For the implementation of special substrates and components for which no spares can be prepared, prior arrangements are extremely important. We propose suitable solutions regarding temperature conditions and implementation methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. Leave the implementation of difficult substrates, such as high-layer, high-current substrates, flexible substrates, and aluminum substrates, to us. 【Examples】 ■ Struggling with the implementation of thick substrates ■ Wanting to implement on an extra-large substrate (external dimensions 1m square) that cannot be fed into a reflow or mounter *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
[Recommended for those with the following concerns and anxieties] ■ I want to mount large PCBs that do not fit in the reflow oven. ■ I want to ensure the reliable mounting of high-cost devices with no surplus. ■ I am worried that the temperature may not be sufficient due to the thickness of the PCB. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.