Examples of flexible substrate processing using materials such as polyimide and liquid crystal polymers.
In the processing of polyimide and liquid crystal polymer materials, we achieve high-quality drilling by using a Gaussian beam with a minimum spot diameter of φ10μm for copper foil removal processing and a top-hat beam for resin processing.
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basic information
Our company sells in-house developed laser processing machines (ranging from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. We specialize in technology development, so we can handle everything from the development of processing methods for new materials and products to contract processing for mass-produced items. Please feel free to consult with us.
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Applications/Examples of results
We have processing experience with difficult-to-machine materials such as polyimide and liquid crystal polymers, so if you are having trouble processing challenging materials, please contact us.
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Company information
At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.
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