Plating process on the inner diameter side of the component.
It is said that plating on the inner diameter side of bag holes (blind holes) and thin ultra-fine tubes is difficult, so we apply plating that is "well-adhered" up to the "inner surface bottom" to ensure sufficient contact area for springs and contacts incorporated on the inner diameter side. This is to prevent any peeling of the plating due to the sliding of the springs and contacts incorporated on the inner diameter side.
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basic information
Shape: Bag hole component (precision turned part processing) Size: Inner diameter 0.7mm, hole depth 5.0mm, aspect ratio 1:7 Material: C3604 Base plating: Electrolytic nickel Final plating: Hard gold (Au-Co alloy) Below are our company’s achievements. Available materials: C3602, C3604, C5341, C5441, C1720, C1730 Types of plating: Electrolytic nickel, electroless nickel (Ni-P alloy), hard gold (Au-Co)
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Applications/Examples of results
Main applications: Contact probe components (for semiconductor equipment / PCB inspection), pogo pins, pogo pin connectors.
Company information
Our business at Ibaraki Plating Industry involves applying plating to metal parts entrusted to us by our customers, in accordance with their requests. Our plated products are utilized in various fields, including sensor components in automobiles, electronic devices such as smartphones, digital cameras, and wearable devices, as well as medical equipment. In recent years, we have focused on "gold plating" of components for semiconductor inspection jigs, as well as micro contacts (plungers) and fine precision springs, which we consider our "strength." We aim to be a company that is trusted and can contribute to our customers, employees, and the local community, and we strive to be a group of engineers specializing in the plating processing field. In particular, we will pursue plating technology for precise and fine electronic components. We kindly ask for your warm support and assistance.
