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  3. 茨城プレイティング工業
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茨城プレイティング工業

Establishment1978 year
capital1000Ten thousand
number of employees56
addressIbaraki/Kitaibaraki-shi/1611-5 Isohara Town, Isohara
phone0293-42-1820
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last updated:Mar 03, 2026
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Plating process for fine precision springs (compression springs)

Coating process for springs with a wire diameter of φ40μm (about the diameter of a hair).

For compression springs that require delicate handling due to their thin wire diameter, we apply a coating that has good adhesion (*1) and is according to the specified film thickness (in sub-micron units) (*2). *1 This is to ensure that the coating does not peel off during the expansion and contraction of the compression spring. *2 This is to ensure that the thickness of the coating does not compromise the load value of the spring.

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Plating process for fine precision springs (torsion springs)

Coating process for a spring with a wire diameter of φ40μm (about the diameter of a hair).

For compression springs that require delicate handling due to their thin wire diameter, we apply a coating that has good adhesion (*1) and is according to the specified film thickness (in sub-micrometer units) (*2). *1 To prevent the coating from peeling off due to the expansion and contraction of the compression spring. *2 To ensure that the thickness of the coating does not compromise the load value of the spring.

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Plating processing of bag holes (stop holes) parts and ultra-fine tubes.

Plating process on the inner diameter side of the component.

It is said that plating on the inner diameter side of bag holes (blind holes) and thin ultra-fine tubes is difficult, so we apply plating that is "well-adhered" up to the "inner surface bottom" to ensure sufficient contact area for springs and contacts incorporated on the inner diameter side. This is to prevent any peeling of the plating due to the sliding of the springs and contacts incorporated on the inner diameter side.

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Plating processing for thin sheet precision press products.

Plating process for thin plate t=0.15mm with a stamping finish.

It is possible to apply a "high yield" plating to thin plate press-processed products that are prone to "overlapping" between products. *1 Normally, overlapping can cause defects such as lack of plating, stains, and unevenness. *2 Yield is the ratio of the number of good products to the input quantity (the quantity processed at one time). Performance of the parts in the photo: Yield approximately 99.80%.

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Plating processing for micro contact components

Ibaraki Plating Industry can apply a coating with good adhesion according to the specified film thickness to micro-contact parts that require delicate handling.

Micro contact component details Size: Outer diameter 150 μm, total length 1.50 mm Material: C3604 Plating specifications: Base plating: Electroless nickel plating Final plating: Hard gold plating (Au-Co)

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